According to the news based on MoneyDJ’s latest report citing industry sources, TSMC is working on the 2nm production line at its Fab 20 facility. 3,000 to 3,500 wafers per month initially It will have (chipplate) capacity. However, TSMC aims to combine this production with its Kaohsiung factory (Fab 22) and increase its monthly capacity to 50,000 wafers by the end of 2025. by the end of 2026 whereas 120.000 ila 130.000 wafer levels are predicted.
Specifically, the production line at Fab 20 is expected to reach a monthly wafer capacity of 20,000 to 25,000 wafers in the fourth quarter of 2025 and 60,000 to 65,000 wafers by the end of 2026. Similarly, it is stated that the Fab 22 facility will produce 25,000 to 30,000 units by the end of 2025 and 60,000 to 65,000 units by the end of 2026.
TSMC Chairman CC Wei has previously emphasized that customer demand for 2nm technology exceeds that for 3nm and that the company is actively working to expand its production capacity. Industry resources Apple is TSMC’s first customer for 2nm He says it will happen. Apple was also the first customer in the 3nm process.
Source
https://www.techpowerup.com/330399/tsmc-is-getting-ready-to-launch-its-first-2nm-production-line
https://www.trendforce.com/news/2025/01/01/news-tsmc-sets-up-2nm-pilot-line-aims-for-130000-wafers-monthly-by-2026/
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