Broadcom introduced the world’s first 3.5D F2F technology

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Broadcom introduced the world’s first 3.5D F2F technology

By admin, Aralık 8, 2024

Broadcom introduced the world’s first 3.5D F2F technology





Broadcom introduced the world's first 3.5D F2F technology



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Broadcom is on the agenda with a groundbreaking technology in the field of artificial intelligence. The company developed in response to the rising demand for artificial intelligence chips. 3.5D eXtreme Dimension System in Package (XDSiP) platform announced. This innovative platform is designed for AI companies looking to develop advanced custom accelerators, or XPUs.

Broadcom’un 3.5D XDSiP platform in one package 6000 mm²of silicone and 12 pieces high bandwidth memory (HBM) stack, it both increases energy efficiency and provides the power required for large-scale artificial intelligence applications. Today, when traditional Moore’s Law scaling methods are insufficient, hundreds of thousands or even millions of XPUs are needed for the training of complex artificial intelligence models. 3.5D technology, 2.5D packaging and 3D silicone stacking by combining the advantages responds to this need.




Broadcom introduced the world's first 3.5D F2F technology



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Located at the center of the 3.5D platform Face-to-Face The (F2F) stacking method directly connects the top metal layers of the chips, minimizing electrical interference and increasing mechanical durability. Traditional Face-to-Back In this way, compared to the (F2B) method, there is a reduction in die-to-die interfaces. Power consumption decreases by 10 times and signal intensity increases by 7 times. Additionally, thanks to smaller interconnectors and package sizes, costs decrease and stability increases.

With this platform, it comes from TSMC’s hands. Leveraging advanced process technologies, the company manufactures four process dies, one I/O die and six HBM modules for the 3.5D XPU platform. Production of Broadcom’s 3.5D XDSiP platform February of 2026 month is planned to start. It is stated that the company is already working on more than five products.






Source

https://interestingengineering.com/innovation/worlds-first-3-5d-f2f-tech


https://www.broadcom.com/company/news/product-releases/62691






















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