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What will Apple M5 offer?
According to South Korean Etnews, Apple’s production partners began to pack the upcoming M5 chips. Processors, 5-10 %improvement in 5 %performance increase and power efficiency Promising TSMC 3NM (N3P) will be produced through the production process. Apple is particularly focused on artificial intelligence pefor. Therefore, the processors are much more To a strong NPU is expected to have.
Apple’s M series chips use the system (System-on-a-a-chip, SOC) in the chip that combines all components in a single package, as we all know. However, in the company’s M5 Pro, M5 MAX and M5 ultra models, TSMC SoIC-MH (System-on-Integrated-Chips-Molding-Horizontal) It is reported that it plans to use its technology. New technology that can be summarized as horizontal molding, It will increase the thermal conductivity by covering 30 %to 50 %less. Thus, without stopping by throttling Full performance for longer will be obtained.
The M5 will also make improvements in the mounting of chips with the motherboard. Improvements in the adhesive layer that holds the chips together and installed them on the card, It will allow more chip to be stacked on top of each other.
Information from the inside, the chip packaging will be made by more than one company reports. Taiwanlı ASE will start its first mass production party, US Amkor and Chinese Jcet will be involved in production at later parties.
In the first half of this year New with M5 processor iPad Pro‘s is expected to be released. Then the M5 Pro, M5 Max and M5 ultra versions will come. Apple has not been releasing ultra processor since m2 M5 Ultra in 2026 is expected to introduce. Therefore, the new Mac Pro and Studio may not be released this year.
Source
https://www.gsmarena.com/mass_production_of_apple_m5_begins_new_generation_will_focus_on_ai_performance-news-66392.php
https://www.etnews.com/20250205000198
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