TSMC is preparing for next-generation chip production with High-NA EUV
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TSMC ready for first High-NA EUV delivery
High-NA EUV lithography is considered a breakthrough technology in semiconductor manufacturing. More than standard EUV systems high resolution and sensitivity This technology can perform patterning on the chip surface at a much finer level. In this way, it becomes possible to produce advanced chips required for artificial intelligence and other advanced technologies.
TSMC launches High-NA EUV scanners 1.4nm aims to use it in the production process (A14). to mass production in 2027 This process, which is planned to start, will further reinforce TSMC’s leadership in 2nm and below technologies. However, intensive testing and process optimizations will be required for these systems to operate at full capacity. Once these systems are fully operational, TSMC is expected to advance to the A10 node, which represents several technological generations beyond its current capabilities. Additionally, TSMC 2026′ yes N2 (2 nm) He also announced that he would put the process into action.
TSMC will reinforce its leadership
The company became the first manufacturer to use commercial EUV lithography with the N7+ process in 2019. It has since rapidly expanded its EUV systems and now accounts for 56% of EUV installations worldwide. TSMC, which operated 84 EUV systems in 2022, increased this number to over 100 in 2023.
ASML, approx. $400 million started deliveries of High-NA EUV systems this year. The first deliveries were made to Intel. It looks like TSCM is next. On the other hand, TSMC’s early acquisition of this equipment means that it can further widen the talent gap with Samsung Electronics.
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